Circuit Board Etching Nozzles

Distribute etching fluid over products and components


An etching process is used to create intricate component and artistic designs on a variety of materials and products. In many etching applications, spray nozzles are used to distribute an etching fluid (typically an acid solution) over the product/component to be etched, which has portions of its surface protected from contact with the acid. The acid removes the portions of the material it is exposed to, leaving the protected areas untouched, allowing it to create complicated and artistic designs in a time efficient manner. Etching is commonly used on glass, copper, and aluminum products along with being used extensively in the manufacturing of printed circuit boards (PCBs).

Circuit boards and electronic wafers for microchips are created using an etching process. The process starts with a thin board or wafer with a full copper coating on one side. An ink that is resistant to the chemical etcher (a photoresist) is printed onto the copper where the circuit pathways will be. The board is then sprayed with an etchant that dissolves the unprotected copper. After this step, the board is then sprayed again with another chemical that removes the ink with the result being a PCB with copper circuits where the ink was. As a final step, the board is washed to remove any remaining chemicals from the process.

Spray nozzles can also be used to wash the components (glass bottles, circuit boards, silicon substrates, etc.) before or after each etching step, mix chemical storage tanks, and wash chemical totes and tanks.
 

Selecting an Etching Nozzle:

Important factors to consider:

  • Nozzle material and compatibility with etching solutions
  • Fluid properties (density, viscosity, etc.)
  • Required coverage
  • Available nozzle mounting locations
  • Available fluid flow rates
  • Available liquid pressure drop (∆P) across the nozzle(s)
    • ∆P = supply pressure at nozzle inlet - process pressure outside nozzle
  • Our experienced engineers can help determine which nozzle will perform as required with your design details

Common Etching Nozzle Uses and Industries:

  • Electronics industry
  • Manufacturing industry
  • Glass bottles
  • Copper strip/foil
  • Printed circuit boards (PCB)
  • Electronic wafers
  • Electronic industries supplying printed circuit boards and electronic wafers

WL

  • Versatile whirl nozzle in a variety of flow rates, spray angles, and materials
  • Whirl vane design produces very uniform coverage
Nozzle Type(s):
Whirl
  • Axial whirl nozzles provide even coverage and wide coverage areas for efficient acid distribution in etching applications
Spray Pattern(s):
Full Cone
Flow Range:
.187 to 10.8 gpm
Typical Pressure Range:
10 to 40 psi
Angle Range:
60 - 120°
Common Materials:
PVC, CPVC, Polypropylene, PTFE
  • Plastics are commonly preferred in etching applications due to the acid spray media and environments

Full Cone

Select a nozzle number below for performance graph, drawings, and to request a quote.
Nozzle Number Connection Sizes Spray Angles gpm @ psi     (density: 1 SG)
10 psi 20 psi 40 psi 100 psi 200 psi 400 psi
WL 1/2 1/8″ 60°, 90°, 120° .260 .360 .498 .766 1.06 1.47
WL 3/4 1/8″ 60°, 90°, 120° .390 .540 .747 1.15 1.59 2.21
WL 1 1/4″ 60°, 90°, 120° .522 .724 1.00 1.54 2.14 2.96
WL 1 1/2 1/4″ 60°, 90°, 120° .782 1.08 1.50 2.31 3.20 4.43
WL 2 3/8″ 60°, 90°, 120° 1.04 1.44 2.00 3.07 4.26 5.90
WL 3 3/8″ 60°, 90°, 120° 1.56 2.17 3.00 4.62 6.39 8.86
WL 4 3/8″ 60°, 90°, 120° 2.08 2.89 4.00 6.15 8.52 11.8
WL 5 1/2″ 60°, 90°, 120° 2.61 3.61 5.00 7.69 10.7 14.8
WL 6 1/2″ 60°, 90°, 120° 3.13 4.33 6.00 9.23 12.8 17.7
WL 7 1/2″ 60°, 90°, 120° 3.66 5.07 7.02 10.8 15.0 20.7

These values are filtered based on search criteria or application and do not represent the full range of nozzles for this series. Click here to see all available series offerings.

MaxiPass

  • BETE's unique, clog resistant S-vane design gives the MaxiPass the largest free passage available for a given flow rate, making it resistant to clogging, efficient, and reliable
  • Easily handles liquids with a high solids concentration
  • High reliability spray performance under the most difficult conditions
Nozzle Type(s):
Whirl
  • Axial whirl nozzles provide even coverage and wide coverage areas for efficient acid distribution in etching applications
Spray Pattern(s):
Full Cone
Flow Range:
.697 to 13.2 gpm
Typical Pressure Range:
10 to 40 psi
Angle Range:
60 - 120°
Common Materials:
PVC, CPVC, Polypropylene
  • Plastics are commonly preferred in etching applications due to the acid spray media and environments

Full Cone

Select a nozzle number below for performance graph, drawings, and to request a quote.
Nozzle Number Connection Sizes Spray Angles gpm @ psi     (density: 1 SG)
3 psi 5 psi 10 psi 20 psi 50 psi 80 psi
MP 125 3/8″ 90°, 120° .697 .886 1.23 1.70 2.62 3.26
MP 156 3/8″ 90°, 120° 1.11 1.41 1.95 2.70 4.16 5.18
MP 187 3/8″, 1/2″ 90°, 120° 1.60 2.03 2.82 3.90 6.00 7.48
MP 218 1/2″ 90°, 120° 2.55 3.24 4.49 6.21 9.56 11.9

These values are filtered based on search criteria or application and do not represent the full range of nozzles for this series. Click here to see all available series offerings.